منابع مشابه
Si nanoparticle interfaces in Si / SiO 2 solar cell materials
All material supplied via Aaltodoc is protected by copyright and other intellectual property rights, and duplication or sale of all or part of any of the repository collections is not permitted, except that material may be duplicated by you for your research use or educational purposes in electronic or print form. You must obtain permission for any other use. Electronic or print copies may not ...
متن کاملSi-Nanotrees: Structure and Electronic Properties
Si-Nanotrees: Structure and Electronic Properties Madhu Menon1, Ernst Richter2 ∗, Ingyu Lee3, and Padma Raghavan3 1Department of Physics and Astronomy and Center for Computational Sciences, University of Kentucky, Lexington, KY 40506, USA 2DaimlerChrysler AG, 89081 Ulm, Germany 3Department of Computer Science and Engineering, Pennsylvania State University, 308 Pond Lab, University Park, PA 1680...
متن کاملc-Si Solar Cells: Physics and Technology
This chapter presents the main stream technology of c-Si solar cells. It explores development in design and technology of the c-Si solar cells from traditional to advanced device architecture. It highlights the historical development in cell design and technology along with the technological approach which are being researched for next generation c-Si solar cells. Starting from most general cel...
متن کاملc-Si Solar Cells: Physics and Technology
This chapter presents the main stream technology of c-Si solar cells. It explores development in design and technology of the c-Si solar cells from traditional to advanced device architecture. It highlights the historical development in cell design and technology along with the technological approach which are being researched for next generation c-Si solar cells. Starting from most general cel...
متن کاملAdvanced PI/SI/EMI Simulation Technology for High-Speed Electronic Design
With the progress of system integration technology, a variety of noise problems, so-called power/signal integrity and EMI issues, have become very serious in the field of chip (LSI), package and board (PCB) design. These problems cause frequently the unexpected behaviors on the today’s high-density and high-speed circuits. Thus, useful remedies are strongly demanded and the development of novel...
متن کاملذخیره در منابع من
با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید
ژورنال
عنوان ژورنال: Journal of the Society of Materials Science, Japan
سال: 1986
ISSN: 1880-7488,0514-5163
DOI: 10.2472/jsms.35.329